Substrates & processes

Substrates

 

  • Thick-film circuitĀ (also own production)
  • Integrated resistor
  • Capacitor
  • Inductance
  • PCB

 

Packaging technologies

 

  • Chip-on-Board (COB)
  • Flip-Chip (FC)
  • Surface Mount Technology (SMT)

 

Processes

 

  • Die Bonding (bonding, soldering)
  • Wire Bonding (aluminum, gold)
  • Glop top
  • Chip underfill
  • Reflow soldering
  • Plasma cleaning
  • Mechanical assemblies